HOW TO INSTALL DVD DRIVE

When you are ready to begin installing your new DVD
Drive,have plenty of roon on your desk or table to
work.Allow enough space to move around and to be
able to move the system unit as well.

Check to see if you have ample light.You may want to
have a container to place small screws in.The system
unit cover may have small screws and you don't want
to lose them.

After you have plenty of work space and ample lighting,
prepare your mind as well.Make this and every other
adventure of working on your computer educational
and fun.

REMOVE THE COMPUTER COVER

First Turn off your computer and unplug all peripherals.
Take notice of how you unplug or disconnect any
devices.

Second Remove the side panel of the tower system or
the cover if you have a desktop.Place the panel in a
safe place well out of the way.

Third Before touching anything inside the system unit,
remove electrical static charge from your body by
touching a door knob or any unpainted metal surface.

Fourth Remove the new drive from its protective
wrapping and take the time to read through the manual.
Be sure you have all components and save the box
just in case it need to be returned.

Fifth Check the jumper settings on the drive to be sure
it is set to master.If you are adding this drive as a second
drive,you will have to set one as master and one as the
slave drive.

Your manual should make this procedure quick and fast.
A small pair of tweezers can be used to remove the
small jumper to the correct position.Most drives are set
to master by default.

SLIDE NEW DRIVE IN COMPUTER

Sixth Locate the drive bay for the cdrom drive.In most
cases,its at the top of the case.If you are removing
another drive,slide it out partially,disconnect cables,
and slide the drive out completely.Take note of the
location of all connections.

If you are installing a new drive the first time,use a
small screwdriver to pop off the 5.25 inch drive bay
cover and bezel on the system unit case.

Seventh Slide the new drive in partially and connect
the data,sound,and power cables to the rear of the
drive.Slide the drive in completely and use small
screws to secure the drive to the case.

In some cases,the drive is secured to the case with the
use of Drive rails.These rails should be mounted on
the old drive if you had to remove one.Check the drive's
manual if your new drive came with side rails.

When connecting the cable,carefully graps the cables
by the ends and not the wires themselves.Carefully
but firmly push the connectors into their sockets until
you are certain of a good connection.

If you are installing this drive as a second drive and
have made this drive the secondary or slave drive,
connect the drive to the center connector on the
Ribbon cable.The master drive must be at the end.

Eighth After all cables are re-connected to the drive and
the drive is secured to the case,replace the system unit
cover,reconnect all peripherals.Be sure the faceplate of
the drive is flush with the front of the computer.

SETUP YOUR NEW DVD DRIVE

Ninth Boot up the computer and in nearly all cases,the
operating system should detect the new drive and
install the device driver if necessary.

In most cases,new cdroms and dvd drives will not
come with a cdrom or diskette with a device driver.
Windows should install the drive with ease.

Some new drives will come with a cdrom full of
software,such as games,music,or movies.Check
this cdrom for software utilities that you may need
to help run and operate your drive.

Tenth Check your new drive to see if Windows has
recognized it.Click on My Computer and you should
see the drives installed.Check for both drives if you
installed the drive as a second drive.

SECOND ASSIGNMENT

OOI Package Type
OOI is short for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.

S.E.P PACKAGE TYPES

S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to a S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 242 contacts.










P.P.G.A
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.











PGA Package Type
PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins.

SECC PACKAGE TYPES

S.E.C.C. Package TypeS.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.

SECC 2

S.E.C.C.2 Package TypeThe S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).

CPU SOCKETS

A CPU socket or CPU slot is a connector on a computer's motherboard that accepts a CPU and forms an electrical interface with it. As of 2007, most desktop and server computers, particularly those based on the Intel x86 architecture, include socketed processors.
Most CPU-sockets interfaces are based on the pin grid array (PGA) architecture, in which short, stiff pins on the underside of the processor package mate with holes in the socket. To minimize the risk of bent pins, zero insertion force (ZIF) sockets allow the processor to be inserted without any resistance, then grip the pins firmly to ensure a reliable contact after a lever is flipped.
As of 2007, several current and upcoming socket designs use land grid array (LGA) technology instead. In this design, it is the socket which contains pins. The pins contact pads or lands on the bottom of the processor package.
In the late 1990s, many x86 processors fit into slots, rather than sockets. CPU slots are single-edged connectors similar to expansion slots, into which a PCB holding a processor is inserted. Slotted CPU packages offered two advantages: L2 cache memory could be upgraded by installing an additional chip onto the processor PCB, and processor insertion and removal was often easier. However, slotted packages require longer traces between the CPU and chipset, and therefore became unsuitable as clock speeds passed 500 MHz. Slots were abandoned with the introduction of AMD's Socket A and Intel's Socket 370.A CPU socket or CPU slot is a connector on a computer's motherboard that accepts a CPU and forms an electrical interface with it. As of 2007, most desktop and server computers, particularly those based on the Intel x86 architecture, include socketed processors.
Most CPU-sockets interfaces are based on the pin grid array (PGA) architecture, in which short, stiff pins on the underside of the processor package mate with holes in the socket. To minimize the risk of bent pins, zero insertion force (ZIF) sockets allow the processor to be inserted without any resistance, then grip the pins firmly to ensure a reliable contact after a lever is flipped.
As of 2007, several current and upcoming socket designs use land grid array (LGA) technology instead. In this design, it is the socket which contains pins. The pins contact pads or lands on the bottom of the processor package.
In the late 1990s, many x86 processors fit into slots, rather than sockets. CPU slots are single-edged connectors similar to expansion slots, into which a PCB holding a processor is inserted. Slotted CPU packages offered two advantages: L2 cache memory could be upgraded by installing an additional chip onto the processor PCB, and processor insertion and removal was often easier. However, slotted packages require longer traces between the CPU and chipset, and therefore became unsuitable as clock speeds passed 500 MHz. Slots were abandoned with the introduction of AMD's Socket A and Intel's Socket 370.

SECOND TRINAL(First Assignment)

BACKPLANE FORM FACTOR

Now for the final form factor called the Backplane; this form factor in a sense is not a motherboard because of the fact it sites on the back of case instead on the side of one. The backplanes have two forms; the Active, which contains no circuits other the ones used for drivers, bus and buffer, and the other version called a Passive Backplane uses no circuits whatsoever, but in all actuality they are put onto the CPU card which is connected to a processor. You will find these form factors in all servers and rack mounted computer systems.

NLX FORM FACTOR

NLXBoards based on the NLX form factor hit the market in the late 1990's. This "updated LPX" form factor offered support for larger memory modules, tower cases, AGP video support and reduced cable length. In addition, motherboards are easier to remove. The NLX form factor, unlike LPX is an actual standard which means there is more component options for upgrading and repair.
Many systems that were formerly designed to fit the LPX form factor are moving over to NLX. The NLX form factor is well-suited to mass-market retail PCs.